Wafer bonding

The precise measurement of "nothing" since 1970

It is with our passion for precision that we support our customers with their vacuum applications. Vacuum allows a great variety of manufacturing processes. The same large field of applications is served by our vacuum products. Included applications are for example process industry, coating, analytics and R & D as well as semiconductor and solar.


    Analogline VSC43

  • Chemical resistant ceramic sensor with FKM sealing
  • Gas type independent measurements
  • Standardized, linear output signal 0-10 V (four wire) or 4-20 mA (two wire)
  • Smartline VSM

  • Wide range combi sensor Pirani / cold cathode
  • Robust sensor design
  • Insensitive against inrush of air

Wafer bonding

Wafer bonding is a procedural step in semiconductor technology, where two wafers are joined. For certain applications like the encapsulation of chip sensors this process is carried out under vacuum.


When loaded the bond chamber is evacuated in a bypass connection by means of the roughing pump until a vacuum level is reached, where the system can be switched smoothly to the high vacuum pump. The bonding process is then performed under high vacuum conditions. Absolute pressure in the bypass-line must be accurately controlled during evacuation in order to prevent damaging of the high vacuum system. During the wafer bonding the vacuum inside the chamber has to be monitored to guarantee the required results.


A VSC43MA4 type rough vacuum transducer is used for controlling the bypass cycle. Its ceramic sensor measures the absolute pressure with the required accuracy and is nearly maintenance-free. The process pressure of the bonding procedure is monitored by means of a VSM transducer with Pirani/Cold Cathode combination sensor.